Analysis of the Characteristics for CPS-microstrip Interconnection Connected by Using Wire-bonding Scheme
Vol. 23, No. 11, pp. 104-109, Nov. 1998
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Cite this article
[IEEE Style]
박기동 and 이현진, "Analysis of the Characteristics for CPS-microstrip Interconnection Connected by Using Wire-bonding Scheme," The Journal of Korean Institute of Communications and Information Sciences, vol. 23, no. 11, pp. 104-109, 1998. DOI: .
[ACM Style]
박기동 and 이현진. 1998. Analysis of the Characteristics for CPS-microstrip Interconnection Connected by Using Wire-bonding Scheme. The Journal of Korean Institute of Communications and Information Sciences, 23, 11, (1998), 104-109. DOI: .
[KICS Style]
박기동 and 이현진, "Analysis of the Characteristics for CPS-microstrip Interconnection Connected by Using Wire-bonding Scheme," The Journal of Korean Institute of Communications and Information Sciences, vol. 23, no. 11, pp. 104-109, 11. 1998.
pISSN : 1226 - 4717
eISSN : 2287 - 3880